ATTEN ST-7700 Preheater

ATTEN ST-7700 is a professional single-zone PCB preheater designed for controlled and uniform preheating of printed circuit boards during soldering, desoldering and electronic repair/rework operations.

The unit provides 700W heating power with an adjustable temperature range of 50°C to 250°C (122°F–482°F) and a 120 × 120 mm heating area.

Preheating the PCB before localized soldering or hot-air rework helps reduce sudden temperature differences across the board. This is particularly useful when working with multilayer PCBs, high thermal-mass assemblies and temperature-sensitive rework processes.

The ST-7700 provides three working modes — Power, Temperature and Curve — allowing heating behavior to be selected according to the process requirement. It also supports adjustable heating ramp rates and preset parameters for repetitive production or repair operations.

An external K-type thermocouple can be connected for real-time PCB/zone temperature monitoring. The thermocouple measurement range is specified as 25°C–600°C, providing additional process monitoring and temperature-control capability.

Technical Specifications

Key Features

• 700W heating power
• 50°C to 250°C temperature range
• 120 × 120 mm heating area
• Single-zone PCB preheating
• Color TFT display
• Power, Temperature and Curve working modes
• Real-time heating curve display
• Adjustable heating ramp rate
• External K-type thermocouple support
• Real-time PCB temperature monitoring
• RS485 communication
• External device control support
• 25 preset parameters
• Intelligent constant-temperature control
• ESD-safe construction
• Compact 210 × 270 × 70 mm design
• Approx. 2.2 kg base-station weight

Applications

• PCB Preheating – Controlled heating of PCB assemblies before soldering or rework.
• SMD Rework – Provides bottom-side preheating during component removal and replacement.
• BGA Rework – Supports controlled board preheating for compatible BGA repair and reballing operations.
• PCB Repair – Helps prepare multilayer and high thermal-mass boards for repair.
• Hot-Air Rework – Can be used with a hot-air rework station to provide bottom-side heating.
• Soldering & Desoldering – Reduces the thermal load required from localized soldering/rework tools.
• BGA Reballing – Suitable for controlled preheating during compatible BGA reballing processes.
• SMT Assembly & Rework – Suitable for electronics production, repair and rework operations.
• Electronics Manufacturing – Useful for controlled PCB thermal processing.
• Repair & Service Centres – Suitable for professional PCB-level electronics repair.