SKU code: #IMT00190
Category Name: Solder Paste and SMT Adhesives
₹10
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Solder Paste is a material used in Surface Mount Technology (SMT) PCB assembly to create electrical and mechanical connections between surface-mount components and printed circuit board (PCB) pads.
It consists of fine solder alloy particles mixed with flux. The paste is deposited onto PCB pads using stencil printing or dispensing, after which surface-mount components are placed onto the deposited paste.
During the reflow soldering process, the solder alloy melts and wets the component terminals and PCB pads. As the assembly cools, the solder solidifies to form reliable electrical and mechanical solder joints.
Solder paste is available in different alloy compositions, powder sizes and flux formulations depending on PCB assembly requirements. Common options include lead-free and lead-based alloys along with no-clean, water-soluble and rosin-based flux systems.
Technical Specifications
| Parameter | Specification |
|---|---|
| Product Type | Solder Paste |
| Composition | Powdered Metal Alloy + Flux |
| Alloy Composition | Sn63Pb37, SAC305 or Similar Alloys |
| Alloy Type | Lead-Free / Lead-Based |
| Powder Type | Type 3 / Type 4 or Equivalent Grade |
| Particle Form | Fine Spherical Particles |
| Flux Type | No-Clean / Water-Soluble / Rosin-Based |
| Viscosity | Optimized for Stencil Printing / Dispensing |
| Application Method | Stencil Printing / Dispensing |
| Melting Point | Depends on Selected Alloy Composition |
| Residue Type | Low Residue / No-Clean |
| Process Compatibility | SMT & Reflow Soldering |
| Shelf Life | 6–12 Months (Refrigerated) |
| Storage Condition | 2°C to 10°C |
| Packaging | Syringe / Jar / Cartridge |
| Application Area | PCB Assembly / SMT Production |
₹10
You save ₹0(1% off)
Inclusive of all taxes
Estimate delivery times: 5-7 days .