Solder Paste

SKU code: #IMT00190

Category Name: Solder Paste and SMT Adhesives

₹10 (1% off)
MRP

₹10

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Solder Paste

Solder Paste is a material used in Surface Mount Technology (SMT) PCB assembly to create electrical and mechanical connections between surface-mount components and printed circuit board (PCB) pads.

It consists of fine solder alloy particles mixed with flux. The paste is deposited onto PCB pads using stencil printing or dispensing, after which surface-mount components are placed onto the deposited paste.

During the reflow soldering process, the solder alloy melts and wets the component terminals and PCB pads. As the assembly cools, the solder solidifies to form reliable electrical and mechanical solder joints.

Solder paste is available in different alloy compositions, powder sizes and flux formulations depending on PCB assembly requirements. Common options include lead-free and lead-based alloys along with no-clean, water-soluble and rosin-based flux systems.

Technical Specifications

Parameter Specification
Product Type Solder Paste
Composition Powdered Metal Alloy + Flux
Alloy Composition Sn63Pb37, SAC305 or Similar Alloys
Alloy Type Lead-Free / Lead-Based
Powder Type Type 3 / Type 4 or Equivalent Grade
Particle Form Fine Spherical Particles
Flux Type No-Clean / Water-Soluble / Rosin-Based
Viscosity Optimized for Stencil Printing / Dispensing
Application Method Stencil Printing / Dispensing
Melting Point Depends on Selected Alloy Composition
Residue Type Low Residue / No-Clean
Process Compatibility SMT & Reflow Soldering
Shelf Life 6–12 Months (Refrigerated)
Storage Condition 2°C to 10°C
Packaging Syringe / Jar / Cartridge
Application Area PCB Assembly / SMT Production

Key Features

  • Fine solder alloy powder mixed with flux
  • Suitable for SMT PCB assembly
  • Supports stencil printing and dispensing
  • Available in lead-free and lead-based formulations
  • Type 3 and Type 4 powder options available
  • No-clean, water-soluble and rosin-based flux options
  • Suitable for automated SMT production
  • Supports fine-pitch component assembly depending on selected powder grade
  • Designed for controlled solder deposition
  • Forms electrical and mechanical solder joints after reflow
  • Suitable for high-volume PCB manufacturing

Applications

  • SMT PCB Assembly – Used for mounting surface-mount electronic components onto PCB pads.
  • Stencil Printing – Applied through a solder paste stencil to deposit controlled quantities of paste onto PCB pads.
  • Automated SMT Production – Suitable for solder paste printing, pick-and-place and reflow production lines.
  • Reflow Soldering – Used to form permanent solder joints between SMD component terminals and PCB pads during the reflow process.
  • Fine-Pitch Component Assembly – Suitable powder grades can be used for fine-pitch and small SMD components.
  • PCB Prototyping – Suitable for prototype PCB assembly using stencil or dispensing processes.
  • Consumer Electronics – Used in PCB assemblies for electronic products and devices.
  • Industrial Electronics – Suitable for control boards, automation equipment and industrial PCB assemblies.
  • Telecommunication Equipment – Used in electronic assemblies for networking and communication products.
  • LED Electronics – Suitable for SMT assembly of LED and lighting circuit boards.
  • Automotive Electronics – Used in SMT PCB manufacturing for automotive electronic assemblies.
  • Medical Electronics – Applicable to SMT PCB assembly used in electronic medical equipment.
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₹10 (1% off)
MRP

₹10

You save ₹0(1% off)

Inclusive of all taxes

Available Units
Quantity
1

Estimate delivery times: 5-7 days .